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January News from IQS |  |
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Dear Customer, For our readers who may have missed last month's special announcement, IQS has been acquired by Degree Controls, Inc. of Milford, NH. This acquisition will help IQS expand its service offerings while continuing to provide customers with the excellent service they have come to expect from IQS. Additional topics in this month's newsletter focus on how RoHS compliance can affect product reliability and the publication of an article written by IQS Laboratory Manager Jason Leboeuf discussing airflow characterization to meet PICMG ECN Shelf Thermal Requirements. Save the date! IQS is sponsoring a NEBS seminar on Wednesday, April 26 in Marlboro, MA. The keynote speaker will be Chuck Graff from Verizon. We will be sending out more details shortly in a separate email.
DegreeC is the world’s leading provider of innovative thermal management solutions. Combined with rapid response and superior customer service, our mission is to ensure overall quality, compliance and thermal integrity of customer’s products. Our real world design experience enables us to understand the realities of project timelines, the need for high quality manufacturing, and the desire for customers to have flexibility in their product development considerations. The combination of IQS and DegreeC means that customers have the ability to pick and choose which products and services are needed to launch new products into the market. From start to finish, DegreeC and its divisions offer a variety of options for our customers, including:
With offices throughout the world, DegreeC and its divisions help customers create solutions that are reliable and cost effective from idea creation to production.
RoHS compliance results in material changes to your product. However, in the rush to meet RoHS, have any of the changes unwillingly caused potential future problems? Basic component changes which seem simple on paper often have unforeseen consequences when incorporated into the final product. The material changes dictated for RoHS compliance may have required you to not only change solder but components as well. These changes can result in unforeseen potential product problems with regards to thermal performance and product reliability. Furthermore, your product may need to be recertified if a clock or other critical component was changed. Contact IQS today to have your RoHS compliant product evaluated for unforeseen technical problems or recertification requirements. IQS’s engineering experts have the ability to quickly review and advise on thermal, reliability and regulatory compliance problems quickly. Don’t be caught sliding down a slippery slope of product failures. Let IQS help you today.
Jason Leboeuf of IQS recently published in article in the December issue of Compact PCI & AdvancedTCA Systems. Titled "Winning at the slots: Strategies for Complying With PICMG ECN Shelf Thermal Requirements 5.4.2", the article discusses the PICMG ECN specifications regarding airflow characterization data for board design use. Although the specification clearly states these requirements, it does not detail the methods to be used in obtaining the data. Jason elaborates on the pertinent sections of the standard as well as providing examples of test methods used to analytically and empirically fulfill the PICMG thermal requirements.
IQS has uploaded its standard forms for regulatory compliance and NEBS testing. These forms allow customers to specify their product details and testing requirements quickly to IQS. You may download the respective documents on the IQS agency approvals page and the NEBS testing page.
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